GlobalCast®
Potting and Encapsulation
GlobalCast® range of Epoxies, Polyurethanes, Silicones and UV curable systems. They are used in low, medium, high voltage applications and feature outstanding electrical insulation properties, superior adhesive strength, thermal stability and superb chemical resistance. Products provide reliable long term performance for microelectronic, electronic, electrical devices, components including:
- Power supplies
- Switches
- Ignition coils
- Electronic modules
- Motors
- Connectors
- Sensors
- Cable harness assemblies
- Capacitors
- Transformers
- Rectifiers
Properties of Potting, Encapsulation and Casting Systems
Applications from “under the hood” to photovoltaic junction box assembly LED packaging to marine modules to submersible pumps GlobalBond potting, encapsulation, casting materials are impervious to hostile environmental conditions. They offer the following advantages:
- Enhanced thermal management properties
- Exceptionally low coefficients of thermal expansion
- Crack resistance
- Protection against corrosion
- Elevated temperature and cryogenic serviceability
- Withstand rigorous thermal cycling and shock
Many of our compounds have been formulated to meet strict industry standards, including:
- UL 94V-0 for flame resistance
- RoHs
- Reach
Low viscosity, self leveling rigid, semi-rigid and flexible compositions eliminate gas entrapment and are ideal for high volume production applications. These solvent free 100% solid systems feature low shrinkage, outstanding dimensional stability, excellent mechanical properties and can be dispensed manually/automatically. They guard against abrasion, shock, vibration, impact, UV, fungus, moisture exposure including salt water immersion. Specific grades exhibit superior thermal dissipation characteristics and have high glass transition temperatures. Heat activiated systems can be cured at low temperatures and exhibit low exotherm even in various wide cross section thicknesses. Soft, low durometer, resilient compositions have excellent stress relief properties for fragile, sensitive components.